1. Responsible for managing the full European sales cycle for semiconductor packaging and testing equipment, including market research, client prospecting, and sales execution.
2. Responsible for developing new markets while maintaining existing client relationships, conducting pre-sales visits, and managing contract negotiations.
3. Responsible for tracking contract fulfillment, managing accounts receivable, and delivering ongoing technical consultation to clients.
4. Responsible for organizing corporate marketing activities and assisting in preparing promotional materials.
5. Responsible for completing other assigned tasks as required.
1. Degree in Optoelectronics, Physics or related engineering field. Optical communication industry experience preferred.
2. Experience in optical chip R&D/testing and SiP/TFLN chip testing. Probe station or ATE background advantageous.
3. Efficient, diligent, and responsible, with strong communication and coordination skills.
4. Strong interpersonal, judgment, decision-making, and planning skills, with customer negotiation and service orientation.
5. Proficient in English. Knowledge of multiple languages such as Mandarin Chinese or French is preferred.
1. Participate in the development and testing of integrated device and chip projects;
2. Responsible for review reports, formulation of DFMEA, document writing, related to product development;
3. Product development revision, process optimization, proposal and design of cost reduction plan;
4. Responsible for tracking and solving problems in the R&D and trial production stage of the product;
5. Patent output.
1. Ph.D or above, major in optoelectronic science and technology;
2. Experience in data center, silicon photonic chip design and tape-out, rich experience in design and tape-out of grating coupler, SSC coupler, MMI, Spliter, high-speed MZ modulator, high-speed Ge/Si PD, etc. is preferred ;
3. Proficiency in using mainstream optical waveguide design software such as Luceda, Lumerical FDTD and Phenix Software;
4. Proficiency in using HFSS or other high-frequency transmission line design software;
5. Proficiency in using semiconductor carrier analysis software such as Atlas;
6. Able to use Matlab to model the simulation results of the above three types of software, and output the chip performance simulation results;
7. Proficiency in using L-edit or other software to draw silicon photonics chip layout;
8. Understand the various processes of CMOS tape-out, and be able to follow up the silicon photonics design tape-out process.
1. BAW filter design: related work on modeling and calculation of equivalent RF circuits (linear, nonlinear,) RF test data fitting and high power of BAW;
2. PDK software automation: ADS/comsol/HFSS simulation software, connecting with python/matlab and other automation software;
3. MEMS technology: conducting statistical analysis on the knowledge and data of real production and microelectronics technology.
1. Ph.D or above, major in communication engineering, microwave, radio frequency design, etc., familiar with RF, microwave, electromagnetic theory, etc.;
2. Have a certain basic programming ability, and be able to use MATLAB, Python, C, Ruby, etc. for algorithm simulation;
3. Familiar with the design and support of components such as RF filter (filter), power amplifier (PA), low noise amplifier (LNA), switch (Switch), etc. FBAR development experience is preferred;
4. Have experience in electromagnetic simulation such as ADS, HFSS, etc., and be familiar with the use of related software;
5. Familiar with the use and calibration methods of test equipment such as network analyzers, spectrum analyzers, power generators, and RF probes is preferred;
6. Be proficient in writing technical documents, and have good document preparation habits and writing standards.
1. Responsible for MEMS sensor chip layout design, structural design, process confirmation and development;
2. Responsible for the simulation of MEMS sensor chips, using finite element analysis software for multi-physics simulation, writing simulation programs, etc.;
3. Responsible for the development of MEMS sensor chip process flow, including laboratory process verification and mass production process development and optimization;
4. Responsible for microscopic analysis of MEMS sensor chips, using SEM, X-RAY, etc. for chip failure analysis;
5. Maintain close contact with the foundry, and commit to promoting the MEMS production process from prototype to mass production;
6. Analyze MEMS product data in production and engineering tests, verify MEMS process changes, design and execute engineering tests to solve process problems or optimize process performance;
7. Assist in completing the design, testing and verification of related module-level products.
1. Ph.D or above, major in electronics, microelectronics, MEMS or semiconductor materials;
2. Proficiency in using MEMS layout design software for layout design, with related work experience in plate making and plate casting;
3. Proficiency in using related design and simulation software for chip structure design and finite element analysis, including thermoelectric, fluid, piezoresistive, piezoelectric and other multi-physical field simulations;
4. Understand the conventional MEMS process of chip processing, such as photolithography, etching, coating, etc., and be able to formulate the processing process of chip samples;
5. Ability to test and analyze chip performance indicators, experience in MEMS pressure chip design is preferred.