It uses high-precision motion platforms for sub-micron alignment, supports automatic pick-and-place and batch coupling to boost production efficiency, and integrates UV/thermal curing systems for high-reliability packaging processes, suitable for optical communication, LiDAR and other fields, aiding high-performance optical device mass production.
Wide range of applications | |
High precision | |
High automation | Supports manual, semi-automatic, fully automatic development Fully automatic dispensing, automatic UV or thermal curing
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Flexibility | Supports multi-lens coupling Supports automatic pick-up of devices and lenses Supports UV to IR bands Compatible with single-mode fiber, multi-mode fiber, VCSEL, PD etc.
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