With the rapid advancement of high-speed optical communications, LiDAR and silicon photonics integration technology, the shortcomings of traditional fibre-coupling methods are becoming increasingly apparent; issues such as low efficiency and alignment difficulties have become bottlenecks hindering the industry’s further development. Eternal is proud to launch the Lens Coupling Packaging System. Through precision optical design, it achieves a coupling efficiency of over 95%, meeting the stringent requirements of high-bandwidth, low-loss optical components. This system brings a brand-new solution to the field of high-precision optical packaging and represents a core technological breakthrough for our company in the silicon photonics packaging sector.
▲Video showing the full operation process of the Lens Coupling Packaging System
The Lens Coupling Packaging System utilises a high-precision motion platform to achieve sub-micron alignment, supporting automatic pick-and-place and batch coupling, thereby significantly enhancing production efficiency. By integrating automated loading and unloading, dispensing, UV curing and temperature control systems, the packaging process is further optimised, ensuring high reliability. This enables the system to be widely adapted to multiple high-demand sectors, such as optical communications and LiDAR, facilitating the mass production of high-performance optical components.
Key Advantages
Utilises a high-precision motion stage system to efficiently locate optimal positioning points;
Equipped with high-precision image recognition, height measurement, force sensing and position sensing systems, effectively improving production efficiency and product quality whilst ensuring equipment precision;
Integrated automatic calibration systems covering UV adhesive volume, UV light energy, and the positions of top and bottom cameras, nozzles and grippers, enhancing the equipment’s automatic error correction capabilities and reducing reliance on human intervention;
Customisable automatic loading and unloading functions minimise operator intervention, allowing a single operator to oversee multiple machines and effectively reducing labour costs;
A Lego-style modular design enables the efficient provision of suitable solutions tailored to customer requirements, whilst allowing for low-cost, rapid upgrades to equipment in line with optical module iterations;
A customisable software interface with freely editable process logic.
This equipment is primarily designed for applications in silicon photonics, thin-film lithium niobate and III-V compound semiconductor chips. Through precise lens coupling, it ensures the optical performance of devices and significantly increases packaging density. The coupling and packaging process is fully automated and supports multi-channel parallel coupling. Compared to traditional manual operations, production efficiency has seen a quantum leap. We welcome enquiries from all customers.