Description
WAT-226 High-power wafer testing system adopts a closed vacuum chamber, which gathers moving components, heating components, cooling components, wafer chucks, probe stations, probe arms and other components used for testing in the closed vacuum chamber. This safe and stable test environment can meet the safety test requirements of extreme conditions such as high temperature, low temperature, high voltage, and high current. Moreover, it can protect devices from physical damage and pollution such as oxidation, condensation, frost, and arc breakdown.
Application
The system is suitable for SiC/GaN, the third-generation semiconductor high-power wafer testing.
Features
High vacuum and low deformation cavity design
Strong voltage: > 10 kV @ 1mm
High current : > 600A
Temperature control range: -60ºC to 300ºC (Support a wider range of customizationt)
Vacuum: <1e-4 Torr
Options of high voltage and high current probes
Option of end-to-end testing solution services
Self-developed core components
High current probe
Curved design of high current probe head
Flexible needle design
Single row 600A
Double row 1200A
Adjustable probe holder
High voltage probe
Tungsten needle tip
Ceramic Needle Arm
High voltage > 20kV
