The system is applicable to the pick-and-place, positioning, testing, and sorting of chips after wafer dicing. It adopts a fully automated operation process and can perform high-speed and high-precision chip testing. The average testing time per single chip can be compressed to within seconds, representing a significant improvement in efficiency compared to traditional methods. The system injects new development momentum into the semiconductor packaging and testing industry.
Wide range of applications | |
High accuracy and repeatability | |
High automation | Automatic calibration, real-time fault diagnosis, and predictive maintenance Loading and unloading supports blue tape or chip adsorption box for various forms Automated chip handling system for fast pickup, positioning, testing, and sorting
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Flexibility | Support OO/OE/EE/RF testing, etc. Fully automated chip testing workflow with intelligent data analysis Parallel testing technology enhances throughput and reduces per-unit cost Supports single/4/8-channel coupled chip testing with high alignment precision
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