The core pitch and end-face lens mode field control are highly accurate, allowing efficient beam focusing after lens processing, significantly enhancing coupling efficiency between optical chips and fibers while minimizing transmission loss. The products support customizable production for channel count, core pitch, and beam mode field diameter (MFD).
Technical Value
By leveraging microlens-based optical mode field control technology, this solution addresses the mode field mismatch between optical chips and fibers, providing a low-loss coupling solution for high-density optical integrated systems.
Applications
High-Speed Optical Transceiver Modules
Multi-Channel Micro-Optical Integrated Devices
Silicon Photonics Chip-Scale Co-Packaged Optics (CPO)
Planar Lightwave Circuit (PLC)
Arrayed Waveguide Grating (AWG)
Active Array Optical Devices and Micro-Electro-Mechanical Systems (MEMS)
Key Benefits
Precision Manufacturing: Core positioning error ≤±0.5μm (X/Y bidirectional)
High Performance: Insertion loss ≤ 0.8dB, mode field diameter compatible with 3μm to 10μm
High Reliability: Heat-resistant quartz glass substrate, operating temperature range -40℃ to +85℃
Flexible Configuration: Supports 2/4/6/8/16 channels (expandable), customizable core pitch of 127μm or 250μm
| Item | Technical Index |
|---|---|
| Number of Channel | 2ch, 4ch, 8ch, 16ch or customized |
| Core Pitch | 127μm/ 250μm, or customized |
| Core Positioning Error | x≤±0.5μm, y≤±0.5μm |
| Fiber Type | MM/ SM/ PM |
| Fiber Length | Customized |
| Polish Shape | Angle-polished, tapered, wedge-shaped, spherical, etc. |
| Substrate Material | High borosilicate glass or quartz glass |
| Insertion Loss | ≤ 0.8 dB |
| Operating/ Storage Temperature | -40 ~ +85 ℃ |
| Dimensions | Customized |