Utilizing advanced machine learning algorithms, the system enables high-precision detection and early warning of defects such as stains, scratches, bumps, fractures, discoloration, and dimensional errors. The system’s minimum detectable defect reaches 0.5μm, supporting 6 sigma Si and 4 sigma Sip process flow.
Wide range of applications | Silicon photonics, TFLN, III-V, SiC, GaN, MEMS wafers etc.
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High accuracy and repeatability | Machine learning algorithms Minimum detectable defect 0.5μm On-the-fly line scanning significantly improves inspection throughput
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Automated test | |
Flexibility | Integrated with a large AI model, with machine learning capability Wafer (2 ~ 12 inch) and die level AOI Multi carrier form including Blue Tape/Gel-Pak/Waffle Pack Compatible with unpatterned wafer and patterned wafer Integrated bright field (BF), dark field (DF) and differential interference contrast (DIC) Detectable defects includes contamination, scratch, bump, break, discoloration, and dimensional error
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